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The PlayStation 5 Pro, Sony’s latest gaming console, represents a significant advancement in immersive entertainment. This cutting-edge system enhances gameplay with a boosted GPU, sophisticated ray tracing capabilities, and PlayStation Spectral Super Resolution (PSSR), an AI-driven upscaling technology. PSSR ensures incredibly sharp visuals and fluid high framerate performance. Today, we offer an in-depth examination of the console’s internal architecture, as Sony Interactive Entertainment engineers Shinya Tsuchida, the PS5 Pro Mechanical Design Lead, and Shinya Hiromitsu, the PS5 Pro Electrical Design Lead, provide expert insights into its groundbreaking technology and design philosophy.
*Throughout this article, “original PS5” denotes the PlayStation 5 model released in 2020, “current PS5” refers to the PS5 released in 2023, and “PS5 Pro” indicates the PS5 Pro released in 2024.
*Warning: Disassembly carries risks of fire, electric shock, and personal injury. Attempting to disassemble your console will void the manufacturer’s warranty.
Shinya Tsuchida (PS5 Pro Mechanical Design Lead) (Right of photo)
Shinya Hiromitsu (PS5 Pro Electrical Design Lead) (Left of photo)
Exterior Design: Incorporating Three Horizontal Blades for Enhanced Airflow
Tsuchida: Before we commence the teardown, let’s examine the PS5 Pro’s exterior design. As a high-performance console, the PS5 Pro necessitates improved cooling. The distinctive trio of slits are innovative ventilation channels, absent in both the original and current PS5 models. This design resulted from extensive collaborations between engineers and designers. Within our team, we’ve termed these slits ‘blades.’ They improve airflow while also serving as a notable design feature.
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Exterior design comparison: original PS5 (left), current PS5 (center), and PS5 Pro (right). The PS5 Pro presents a slightly reduced footprint compared to the original PS5.
Maintaining design consistency within the PS5 product family, the PS5 Pro features three prominent blades contributing to superior ventilation.
Noise Reduction: Integrating ‘Louvers’ for Quieter Operation
Tsuchida: Internally, the PS5 Pro incorporates a “louver” structure positioned between the primary unit and the cover. These louvers, resembling a series of slats or fins, are designed to minimize fan noise directed towards the front of the console. Given that users typically face the front of the console during gameplay, we strategically engineered the system to reduce perceptible fan noise for players.
Rear Panel Redesign: Optimizing Airflow Efficiency
Tsuchida: Now, let’s turn our attention to the rear of the console. We prioritize the positioning and type of input/output ports. Aligning with previous design philosophies, the power button remains at the bottom for vertical orientation accessibility. Conversely, the HDMI, LAN, and USB ports are situated slightly higher compared to the current PS5. This adjustment accommodates the PS5 Pro’s high-density circuit design within its mainboard, necessitating a revised port arrangement.
Furthermore, the exhaust vent area is enlarged compared to other PS5 versions, facilitating improved air intake and exhaust from the rear and bottom surfaces. Recognizing the crucial role of vent dimensions for effective ventilation, preliminary studies confirmed the necessity for larger vents than the current PS5. The final dimensions were determined through collaborative discussions with the design team.
Initiating the Teardown Process
Tsuchida: Let’s commence the teardown. Similar to previous PS5 models, a dust catcher is incorporated on the top panel for maintenance. The bottom panel features an M.2 SSD slot, a disc drive connector, and a compartment for accessing the coin cell battery.
Tsuchida: The battery screw is intentionally designed to remain attached to the battery cover. This thoughtful safety measure prevents loss and accidental ingestion.
Advanced Fan Design: Enhancing Airflow While Minimizing Noise
Tsuchida: After disconnecting the fan cables, we can now remove the blades and inner shell, and then the fan assembly itself. As previously mentioned, the PS5 Pro requires greater cooling capacity, and the fan is engineered to deliver superior airflow efficiency. The fan unit is also physically larger than that of the current PS5 model.
Comparison of the PS5 Pro fan (left) and the current PS5 model fan (right).
Tsuchida: While both fans utilize an equal number of blades, our engineers refined the blade shape for enhanced performance. Upon closer inspection, you’ll observe smaller blades interspersed between the main blades. Generally, high airflow efficiency is a primary indicator of a superior fan design. However, our objective was to develop a fan capable of generating more airflow “quietly”. While increased noise may be tolerated for greater airflow in some contexts, this is undesirable for gaming consoles where it can negatively impact the user experience. This specific design philosophy is, I believe, unique to PlayStation consoles.
Electromagnetic Interference Suppression: Strategic Screw Placement
Tsuchida: Next, we’ll remove the metal shield situated further inside the enclosure. This shield is affixed to the mainboard by numerous screws, deliberately positioned to mitigate electromagnetic noise. Components on the mainboard generate electromagnetic emissions which can interfere with nearby electronic devices like smartphones. To prevent operational disruptions, we must limit these emissions below a defined threshold. The strategic placement of these screws contributes to minimizing electromagnetic interference.
Evolved Motherboard: Powering Enhanced Gameplay Performance
Tsuchida: Upon removing the top and bottom shields, we access the PS5 Pro’s motherboard. A key characteristic of PS5 consoles is the utilization of liquid metal as the Thermal Interface Material (TIM) for the main processor, known for its exceptional thermal conductivity. Before detailing the application, let me elaborate using a board prior to liquid metal application.
The PS5 Pro motherboard is larger than the current PS5 counterpart. The current PS5 motherboard board exhibits a curvature near the fan location, whereas the PS5 Pro features a larger, flatter board. This expansion accommodates the increased circuitry necessary to achieve the PS5 Pro’s improved performance, subsequently influencing the fan position. As previously highlighted, the input and output port locations on the rear panel are also modified.
Top view of the PS5 Pro motherboard.
Top view of the current PS5 model motherboard.
Hiromitsu: The SoC (System-on-a-Chip), the prominent chip centrally located on the board, is responsible for rendering high-resolution, high-frame-rate graphics, including PlayStation Spectral Super Resolution (PSSR). PSSR leverages AI-enhanced resolution for ultra-high-definition gameplay. To maximize SoC performance, the power delivery pathways have been enhanced compared to the current PS5.
Furthermore, the PS5 Pro motherboard incorporates more layers than the current PS5. Examining the surface of the current PS5 motherboard, the traces connecting the SoC and RAM are visible. However, these traces are barely perceptible on the PS5 Pro motherboard. This is due to the incorporation of additional internal layers in the PS5 Pro’s motherboard design, enabling more efficient signal routing within the inner layers, resulting in faster memory performance.
Now comparing the reverse sides of the motherboards, the primary visible difference is the increase in RAM modules surrounding the SoC, from eight to nine. Previous PS5 consoles, including the current model, were equipped with eight high-speed GDDR6 memory chips for high-speed game rendering and low-speed OS processing. In the PS5 Pro, a ninth DDR5 memory module is dedicated to lower-speed processes, while the eight GDDR6 modules are exclusively responsible for high-speed rendering for gameplay. The integrated GDDR6 RAM modules themselves are also upgraded, offering faster performance compared to earlier PS5 models.
Rear view of the PS5 Pro motherboard. A ninth DDR5 memory chip has been added to the upper right corner (highlighted in red), supplementing the circular arrangement of eight GDDR6 chips.
Rear view of the current PS5 model motherboard.
The groundbreaking utilization of liquid metal remains a core technology, continued across subsequent PS5 iterations.
Tsuchida: Implementing liquid metal as the TIM in the original PS5 presented significant challenges. Due to its vastly superior cooling properties compared to conventional TIMs, its adoption followed extensive safety validation testing.
We dedicated substantial research to insulation during the original PS5 development. The fundamental structure persists in the PS5 Pro, however, we implemented refinements by introducing fine grooves in the liquid metal application area to ensure enhanced cooling stability. During the original PS5 research phase, we anticipated semiconductor advancements towards higher density, leading us to believe liquid metal technology would become essential, a prediction that proved accurate and pivotal for the PS5 Pro design.
For improved cooling stability, grooves have been added to the liquid metal application area.
Enhanced Power Supply Unit: Delivering Increased Output
Hiromitsu: This component is the power supply unit. The PS5 Pro exhibits an approximate 48W increase in power output compared to the current PS5, reflected in its larger physical dimensions. These curved power supply units are meticulously engineered for each PS5 generation to ensure a precise chassis fit. An interesting detail— “Sony Interactive Entertainment” is subtly engraved near the bottom, serving as a guide for correct vertical orientation. While not immediately apparent to consumers, this detail aids assembly and correct orientation during vertical placement.
Optimized Heat Sink Placement for Efficient Cooling
Tsuchida: The heat pipes are constructed from copper. The silver heat sink components are aluminum for heat dissipation, with the remaining gray sections made of steel.
The PS5 Pro heat sink features an increased number of heat pipes, reflecting the higher performance cooling demands. Heat pipes are positioned adjacent to the SoC, and the fins responsible for heat transfer are divided into two sections. Given the substantial impact of heat sink placement on cooling efficiency, considerable effort was invested in determining the optimal layout.
Adopting Wi-Fi 7: Enabling Faster Wireless Connectivity
Hiromitsu: The top side of the mainboard houses the Wi-Fi 7 module. Wi-Fi 7, a newly released standard in 2024, was selected for the PS5 Pro due to its superior performance and future capabilities.
During the PS5 Pro’s development, Wi-Fi 7 was not yet officially released, posing validation challenges. However, we are pleased to be early adopters for a gaming console, achieving certification in time for launch in regions supporting Wi-Fi 7.
The white section visible at the bottom right of the board’s top side is the Wi-Fi 7 module. An antenna is also positioned directly beneath it.
That concludes our overview! We trust you found this exploration of the PS5 Pro’s internal architecture insightful. Each component harmoniously contributes to realizing the console’s innovative features, delivering exceptional graphics and seamless gameplay.